Method of electroplating a substrate, and products made thereby

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Show simple item record Glezen, John H. Naseem, Hameed A. Brown, William D. Schaper, Leonard W. Malshe, Ajay P. 2013-10-31T15:18:27Z 2013-10-31T15:18:27Z 1999-02-23 1997-03-24
dc.identifier US5873992
dc.description.abstract Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.
dc.subject Electrolysis: Processes, Compositions Used Therein, and Methods Of Preparing the Compositions
dc.title Method of electroplating a substrate, and products made thereby
dc.type patent
dc.description.department Electrical Engineering
dc.description.department Mechanical Engineering
patent.identifier.applicationnumber 08/824,077

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