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Method of electroplating a substrate, and products made thereby

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dc.contributor.author Glezen, John H.
dc.contributor.author Naseem, Hameed A.
dc.contributor.author Brown, William D.
dc.contributor.author Schaper, Leonard W.
dc.contributor.author Malshe, Ajay P.
dc.date.accessioned 2013-10-31T15:18:27Z
dc.date.available 2013-10-31T15:18:27Z
dc.date.issued 1999-02-23
dc.date.submitted 1997-03-24
dc.identifier US5873992
dc.identifier.uri http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5873992
dc.identifier.uri http://hdl.handle.net/10826/751
dc.description.abstract Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.
dc.subject Electrolysis: Processes, Compositions Used Therein, and Methods Of Preparing the Compositions
dc.title Method of electroplating a substrate, and products made thereby
dc.type patent
dc.description.department Electrical Engineering
dc.description.department Mechanical Engineering
patent.identifier.applicationnumber 08/824,077


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